Heatsink Bonded Fin - Bonded Fin Heat Sinks from Comair Rotron

Bonded fin heatsinks may best be described as taking a stamped or pre-fabricated plate and bonding it into a channel feature located on a heat sink base plate. These products have many of the similar design and cost benefits as folded fin heat sink assemblies (including machining of the base plate before heat sink assembly. One of the important differences is that these products are generally targeted for very high power devices (200W+), but not necessarily high flux devices.

Other advantages to bonded fin heatsinks are that large format heat sinks are easily produced. Bonded fin heat sinks can be created from extrusions, castings or even plate stock. The key to decide what technology to use is based upon the design requirements. Our engineers will help step you through the development process to pick the right technology for your application.

One benefit to bonded fin heatsinks is that prototypes can be developed that can be a precursor to leading into another technology without having to go through the hard tooling process.

Bonded Fin Specifications and Design Guidelines
Parameter	Specification
Materials	Aluminum, Copper
Minimum Wall Thickness	0.030 inches (0.76 mm)
Maximum Wall Thickness	0.100 inches (2.54 mm)
Maximum Fin Pitch	86
Maximum Aspect Ratio	30:1
Maximum Flowlength	24.0 inches (609.6 mm)
Maximum Height	8.0 inches (203.2 mm)
Length	Not Restricted
Width	Not Restricted
Attachment Methods	Epoxied, Brazed, Soldered

From design to production, we are able to assist you in all stages of the development cycle to ensure the most cost-effective design, material and process configuration for your bonded fin heatsink. Our engineers are prepared to work with your designs, while taking into consideration the necessary production and design requirements (assembly) to help you achieve the most economical part configuration at the optimum performance level.