Heatsink Products - Heat Sink Products from Comair Rotron

Heat Sink Products
Board Level Heat Sinks
	Comair Rotron stocks a number of standard product heatsinks for a variety of applications. These products cool specific packages, such as BGA, TO220, TO247, TO218, and DC-DC Converters. Each heatsink offers standard options, such as attachment methods and thermal interface materials which may be used to customize the part to your specific application. The board level products are made from an extrusion, stamping, folded or bonded fin.
BGA Heat Sinks
	Designed to cool CPU chipsets, ASIC devices, telecommunication chips and AGP (graphics) chips, these heat sinks have been designed to maximize thermal performance while minimizing weight. Each heat sink comes with a variety of attachment methods to conform to any design whether attaching directly to the PCB or to the package. Regardless of the method utilized, these heat sinks are easy to assembly and all maintain a constant interfacial pressure on the chip when assembled.
Microprocessor Heat Sinks
	Comair Rotron has produced a wide range of heatsinks for both Intel and AMD microprocessors. Engineering design and manufacturing assembly has never been so easy with complete turnkey solutions that include the attachment clip, interface material, and the necessary retention or grounding mechanisms. Comair Rotron has experience with designs including embedded copper heat spreaders, heat pipes and copper heatsinks. Because of the unique nature of these designs, most of our products are application specific.
DC/DC Converter Heat Sinks
	Comair Rotron designed these heat sinks specifically for full, half and quarter brick DC-DC converter package formats from a variety of manufacturers. The fin design maximizes the airflow through the fin channels, as well as, optimizing the number of fins per linear inch of each profile to achieve the lowest volumetric impedance. Comair Rotron will modify any of these designs to accommodate the various mounting patterns used by DC-DC converter manufacturers. The factory will also apply high performance phase change thermal interface material as an optional add-on with these heatsinks. To complete the package, order an optional hardware installation kit with the heat sink.
High Power Heat Sinks
	Many specialized types of semiconductor devices operate at the very high power density levels and require a more engineered and intense thermal solution. Comair Rotron develops efficient cooling solutions for the electric vehicles, telecommunications, military, aerospace, welding equipment, motor controls, traction drive, and HVDC industries using a methodology of applying standard product manufacturing technology and know-how towards specific to cooling high power electronics.
Active Fan Heat Sinks
	Fan heat sinks with their small size, ability to provide spot cooling, and relative efficiency make them an ideal cooling solution. Use either an axial fan or fan blower mounted on top of or next to a heatsink to generate local airflow around the fins of a heat sink. The directional airflow provided by the fan ensures high efficiency heat transfer from the fins to the ambient air.
Extrusions
	You may choose from Comair Rotron's over 500 different standard extrusion profiles or request a profile customized to your specific application. From these profiles, we have made heat sinks for all types of applications including amplifiers, computers, power rectification and other industrial applications. Comair Rotron has produced an abundance of profiles, including enclosures, flatback, open channel, double sided, bar and angle shapes.
Stampings
	Stampings involve a pressing process where aluminum or copper coil stock is formed into a discreet, three-dimensional heatsink shape. Heat sinks made by this process are specific to a particular JEDEC package series (e.g. TO220, To247, etc.). These products are typically used when the total thermal power dissipation of the devices is less than 15W (low power) and low heat flux (less than 5W/cm²). Thermalflo can produce stampings from aluminum, copper and stainless steel materials. Add labor saving accessories such as solderable tabs, semiconductor mounts, thermal interface materials and attachment clips to enhance production.
Bonded Fin Heat Sinks
	Used for very high power devices (200W+), Comair Rotron can take your thermal requirements and produce the bonded fin heat sink to cool your high power application.
Folded Fin Heat Sinks
	For high power density applications, heat sinks manufactured with folded fin technology cool where extrusions can't. By using thinner fins made of higher thermally conductive materials folded fin heat sinks deliver significantly lower thermal resistances in the same volume as extruded heat sinks.
Forging Capabilities
	Forged heat sinks is an additional manufacturing technology offered by Comair Rotron that complements our total product offering. This technology allows for unique geometrical structures to be formed out of pure aluminum alloy.
Cross-Cut Heat Sinks
	Cross-Cutting is a manufacturing technology operation which converts a straight finned extruded heat sink into a pin-fin arrayed pattern. The new pin-fin array results in an omnidirectional heat sink design, which has an improved thermal performance over straight finned extruded heatsinks in natural convection, low or undefined air flow regimes and impingement cooling designs.
Custom Machining
	Comair Rotron is a leader in high-speed, ultra precise machining, manufacturing, and processing for the electronics industry with an emphasis on heat sinks and other thermal products. Our facility is equipped and staffed to produce complex components and assemblies. We are globally recognized for our high quality, reasonable costs, and ultimate customer service. We strive to be the best in the industry and will continue this achievement through our high performance workforce and cutting edge technology.