High Power Heat Sinks

Comair Rotron specializes in cooling many types of semiconductor devices that operate at very high power density levels and require an engineered thermal solution. Some examples of high power applications benefitting from Power Fin heatsinks: Rectifier Devices (e.g. Phase Control Thyristors and Diodes) Medium Voltage Thyristors (e.g. Power Switches) Fast Switching Devices (e.g. Fast Turn-off Thyristors and Fast Recovery Diodes) IGBT's including Gate Controlled Devices, GTO Thyristors RF & Microwave Solid State Amplifiers Comair Rotron has developed a unique cooling solution that combines the superior fin to base thermal conductivity and mechanical properties of extruded heat sinks with the high fin density and low thermal resistance of bonded and folded fin heatsinks. Use the form below to select the best Power Fin heatsink for your cooling application. If you do not see what you need, contact us about designing a solution for your application.

Power Fin Heatsink Selection Enter your dimensional and/or thermal requirements. Enter enough information to narrow your heatsink search, then press the search button. (Pressing the search button with no requirements will show all Power Fin heatsink profiles.)

Dimensions	in   Length:   Width: Min   Height: Min mm Max Max
Thermal Resistance	°C/W Max Natural Convection   Forced Convection at LFM m/s
Sort By:	Part Number Thermal Resistance Height Width

Some of the other technologies Comair Rotron incorporates in developing high power electronics cooling systems are: Folded Fin Heatsink Technology Bonded Fin Heatsink Technology Copper Heatsinks Integrated Heat Pipe and Heat Sink Solutions To learn more about these and other technologies that can be used for developing high power cooling solutions, please contact Comairrotron's Engineering Department today.

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